Electroplating device.



J. E. WOODBURY.

ELECTROPLATING DEVICE.

APPLICATION FILED MAR. 29. I918.

Patented Nov. 26,1918.

'l/ll/I/I/Il/l/I/l r///////////1//////l/z JOHN E. WOODBURY, OF WORCESTER, MASSACHUSETTS.

nLEo'rnoPLATIivG DEVICE.

Application filed March 29, 1918.

To all whom it may concern:

Be it known that I, J OHN E. WoopBURY, a citizen of the United States, resldlng at Worcester, in the county of Worcester and State of Massachusetts, have invented a new and useful Electroplating Device, of Wl'llC-ll the following is a specification.

This invention relates to a device for elcctro-plating and while capable of general use it is designed particularly for repairing copper printin plates.

In printing rom copper plates, 1t 1s often necessary to change the names of corporations, their officers, addresses, etc., and this is done without destroying the whole plate in order to avoid the production of a new one. These changes are usually made by scraping the letters out and then tapping the back of the copper plate to raise the hollow surface at least even with the printing surface of the plate and then resurfacing and polishing the spot and re-engraving. It is all right in short runs of not over a few hundred prints, but where the run is greater, for example a thousand -or more, the copper is so thin where the change has been made as to be a source of great weakness. The pressure required to print the letters is apt to cause a slight bend in the copper which soon results in cracking 1t completely through and preventlng good printing.

Several ways have been devised for filling the back of such a plate.- Filling it with solder has proved completely unsatisfactory, mainly on account of the fact that the solder is easily worn away and lacks strength. Autogenous welding would be unsatisfactory because the heating of the plate would destroy the hardness of the copper. Under ordinary conditions electrodeposition would be too slow for practical use. It is well known that the process of electrodeposition is materially facilitated by the agitation of the electrolyte.

This invention is designed to provide a maximum of agitation for the purpose of preventing the formation of nonconducting bubbles of gas on the cathode, and the impoverishment of the solution nearest the cathode, and therefore to secure not only uniform and complete deposition of the metal but rapid results by permitting of a high current density. The continuous removal of the electrolyte from the surface is an important function of this invention Specification of Letters Patent.

Patented Nov. 26, 1918.

Serial No. 225,404.

and this cooperates with the above mentinually and immediately removing it, is

definitely and practically developed. Reference is to be had to the accompanymg drawings, in which- Figure l is a plan of a preferred embodiment of this invention;

Fig. 2 is a central sectional view on the line 2-2 of Fig. 1;

. Fig. 3 is a sectional view of the pump on the line 33 of Fig. 1;

Fig. 4 is a plan of the operative portion of the pump showing what is below theline 44 in Fig.3; I

Fig. 5 is a sectional view on the line 55 of Fig. 2 showing the arrangement for suppolting the cathode and holding the anode, an

Figs. 6, 7 and 8 are three enlarged sectlonal views of a printing late showing respectively the condition 0 the plate before the metal is deposited on it, the condition of it after the deposition, and its condition after it is re-surfaced.

The invention is shown in a simple form,

in which a glass receptacle 10 is employed as a holder for the liquid electrolyte. This receptacle is provided with a non-conducting cover 11 having an opening 12 therethrough. Above this-coverand supported upon it is an insulating cathode support 13 which can be formed of the same insulating material as the cover. This support is shown as a sort of receptacle in which is placed, up above the surface of the electrolyte, the cathode C, that is, the intaglio copper printing plate shown in Figs. 6, 7 and 8. The surface of the support 18 is shown sunk for the purpose of receiving the cathode and is provided with pins 15 constituting gages for locating the cathode plate C longitudinally and sidewise. The cathode is placed on this support or receptacle 13 in such a ay that the hollow 16 comes directly over a perforation 17 therethrough which is in registration with the perforation 12.

On the bottom of the cover'll'is a copper plate 20 which is provided with a binding screw 21 which connects with a terminal 22 of the electric circuit, the other terminal 23 of which is placed in contact with the oathode plate C. This plate 20 also has a clip 24 adjustably fixed thereon and bearing against the anode A and constituting part of the circuit. This anode is shown as arranged in an upright position and consists of copper, in the present instance. It is pressed by a clip 24 against an open face of a nozzle 26 in such a manner as to close that side of the nozzle and leave a slot 27 at the top constituting the outlet of the nozzle.

The nozzle is connected by a tube 28 with a rotary pump casing 29 immersed in the electrolyte and supported from the cover 11 by bolts 30 or the like. It is operated from a motor 31, belt 32, pulley 33, and shaft 3t connected with a wheel 35 hich rotates and draws the liquid in through the inlet 36 and forces it into the nozzle 26. There it necessarily passes along the surface of the anode A and emerges from the nozzle in a solid stream, so to speak, that is a concentrated How of electrolyte is secured which impinges against a restricted area of the bottom surface of the printing plate C, namely against the hollow 16. I prefer to leave a space between the top of the hard rubber nozzle 26 and the plate C so that the electrolyte can flow in both directions. On account of flowing upward against the lower surface of this plate and at a slight angle itnecessarily falls away from it immediately, but it conducts the current on account of its being arranged so as to furnish a constant and voluminous liquid supply and the electro-plating operation is performed through it. This results in forming a deposit, as for example 37, in the hollow l6 completely filling it as shown in Fig. 7. This is afterward surfaced off on the back as shown in Fig. 8, it being understood that the engraving on the plate is on the opposite or upper side. The clip 2d can be loosened readily when the anode has been partly consumed and the anode moved up and fixed in position.

It will be seen that on account of this arrangement there is no danger of having any deposit on the printing side of the plate or on any part of the back except that toward which the liquid is directed. Furthermore the electrolyte is delivered in large amounts in the form of a concentrated stream and removed with equal rapidity so that the effective agitation of the electrolyte is secured and a great current density is possible. Bv

this machine very closely localized additions of metal are secured without necessitating any special precautions, such as painting up. On account of the great current density possible considerable amounts of metal can be added within a reasonable time so that it is a comparatively quick process. I have employed it in practice and find that it works with extremely satisfactory results in practical operation. I

Although I have illustrated and described only a single form of the invention and specified it as being used only for the repairing of copper printing plates, I am. aware of the fact that the invention is capable of general use, and that it can be carried out in other forms without departing from the scope of the invention as expressed in the claims. Therefore I do not wish to be limited in these respects, but what I do claim is z 1. In an electro-plating device, the combination with means for holding an electrolyte and means for supporting a cathode outside the electrolyte. of an anode, means for delivering electrolyte over the surface of the anode in a constant concentrated stream into contact with a restricted surface of the cathode, and means for passing a current from the anode to the cathode through said stream.

2. In an electro-plating machine, the combination with means for holding an electrolyte and means for supporting a cathode outside the electrolyte, of an anode, means for delivering electrolyte over the surface of the anode in a concentrated stream into contact with a restricted surface of the cathode, said restricted surface of the cathode being located in such position that the electrolyte will be compelled immediately to flow away from it without resting thereon, and means for passing a current from the anode to the cathode through said stream.

3. In an electro-plating device, the combination with means for holding an electrolyte and means for supporting a cathode outside the electrolyte, of an anode, means for delivering a stream of the electrolyte upwardly over the surface of the anode and im mediately against a restricted surface on the bottom of the cathode, whereby all the liquid falls away from the cathode immediately, and means for passing a current from the anode to the cathode through said stream.

4. In an electro-plating machine, the .combination with means for holding an electrolyte and means for supporting a cathode above the surface of the electrolyte, of an anode extending upwardly toward the cathode, a nozzle located above the electro- I lyte and extending upwardly, the anode constituting one surface of the nozzle, said nozzle having an outlet opening at the upper edge of said anode located in position to direct a concentrated stream'of liquid against a restricted area on the bottom of the cathode, a pump in the electrolyte for forcin a constant stream of electrolyte into sai nozzle and out through the outlet thereof, and means for passing a current from the anode to the cathode through said stream.

5. In an electroplating machine, the combination of a receptacle for an electrolyte, said receptacle having a cover, a support located on said cover and having an opening therethrough, the cover also having an opening adapted to register with the opening in the support, said support having a cathode on its surface outside the electrolyte,'a pump in the receptacle, a nozzle connected with ings, an anode constituting one surface of the nozzle, and means for passing a current from the anode to the cathode through the stream issuing from the nozzle.

6. In an electro-plating machine, the combination of a receptacle for an electrolyte, said receptacle having a cover, a support located on said cover and having an opening therethrough, the cover also having an opening adapted to register with the opening in the support, said support having means thereon for holding and locating acathode on its upper surface outside the electrolyte,

said pump and extending up into said opennation with means for supporting a cathode,

of a nozzle having an open'side, the upper end of which extends nearly into contact with a cathode carried by said support, an anode, a conductin plate, a clip on said plate located in position to press said anode against the open side of the nozzle, and means for forcing electrolyte through the nozzle above the edge of the anode against the cathode.

8. In an electro-plating machine, the com ,bination with means for holding'an electrolyte and means for supporting a cathode above the surface of the electrolyte, of an anode extending toward the cathode, a nozzle having an outlet opening at the upper edge of said anode located in position to direct a concentrated stream of liquid against a restricted area on the bottom of the cathode, a pump for forcing a constant stream of electrolyte into said nozzle and out through the outlet thereof, and means for passing a current from the anode to the cathode through said stream.

In testimony whereof I have hereunto affixed my signature. JOHN E. WOODBURY. 

